Constant THERMAL_MODEL_PROVENANCE 

pub const THERMAL_MODEL_PROVENANCE: &str = "Sourced: bulk k per Material (Incropera/CRC, benchmarks/silicon/analog/thermal-constants.md); digital \
     tier power from benchmarks/silicon/sky130_power.json (OpenLane signoff, carried verbatim); \
     TSV per-via g DERIVED from sourced k_Cu. Modeled (OUR design parameters, never silicon): \
     film-coefficient carried points h = 10 / 100 / 2000 W/(m2.K) for natural / forced-air / \
     cold-plate (Incropera Table 1.1 RANGES are the sourced part), analog-tier coarsening grid, \
     500 um thermal cell edge, 10 um bond thickness, underfill-class bond k, 1e-4 W per-tile \
     bias power, cross-tier via attachment at mapped coarse cells. Full dossier: \
     benchmarks/silicon/analog/thermal-constants.md";

Provenance of the model’s figures — pinned by thermal_provenance_lock.