Module thermal 

The certified thermal map — G·ΔT = P over exact ℚ, judged independently.

The stack becomes a steady-state conductance network at tile granularity: analog tiers coarsen to a small thermal grid (a MODELED fidelity statement, not physics — the knob is in ThermalOpts), digital and interposer tiers are single slabs, lateral conductance is the sourced bulk k per square (k·t), the gap between tiers carries the bond-layer background PLUS the provisioned vertical interconnect — with the crossings the placement ACTUALLY consumed attached at their mapped cells, so cooling is placement-dependent (the TSV-as-heat-lever, measured by the lock, not asserted). Cooling classes ground the top and bottom faces through the dossier’s carried film coefficients; the digital tier injects its SOURCED signoff power; occupied analog tiles inject the MODELED bias power.

The solve is exact Gaussian elimination over ℚ, and the emitted ThermalClaim is judged by logicaffeine_proof::thermal_replay::check_thermal_claim, which reassembles the Laplacian itself — the same one-residual-checker trust pattern as the relaxation lane. A network whose heat has nowhere to go refuses AnaLowerError::ThermalModelDisconnected, never a fantasy equilibrium.

Structs

ThermalMap

A certified-solvable thermal map: the exact claim plus f64 conveniences for consumers.

ThermalOpts

The modeled-fidelity knobs. Every figure is a design parameter of OUR model, labeled in THERMAL_MODEL_PROVENANCE and anchored in benchmarks/silicon/analog/thermal-constants.md.

Constants

THERMAL_MODEL_PROVENANCE

Provenance of the model’s figures — pinned by thermal_provenance_lock.

Functions

check_cooling

Judge the CERTIFIED map against the stack’s DECLARED cooling budget: every junction must sit under t_junction_max_c at the stated ambient. The refusal names the hottest node, its tier, both temperatures, and the cooling class — the same program may compile under a stronger class; that verdict belongs to the checker’s map, not the producer’s optimism.

cooling_class_name

The name of a cooling class, for refusal messages.

film_coefficient_w_m2k

The carried film-coefficient point for a cooling class, W/(m²·K).

thermal_default_opts

The V1 defaults.

thermal_map

Build and exactly solve the stack’s steady-state thermal network for one placed region.