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Module stack

Module stack 

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The constructive 2.5D/3D stack ADL.

A stack is COMPOSED, not monolithic: tiers (each an analog fabric, a digital power-map descriptor, or a bare interposer) separated by gaps whose vertical interconnect is a SCARCE, counted resource — TSVs conduct heat as well as signal (g_w_per_k is a design lever the thermal phases measure, not an afterthought). Every physical figure carries a FigureStatus: sourced (cited in benchmarks/silicon/analog/thermal-constants.md), derived (arithmetic shown), or loudly modeled — never invented.

Phase S1 is the SPINE + the degenerate embed: StackTarget::single wraps today’s 2D analog lane with zero behavioral change (analog_artifact_on_stack delegates and the lock proves bit-identity), and StackTarget::sky130_stack_v1 states the V1 stack — the digital tier DELIBERATELY in the analog tier’s heat path, so the thermal phases (S3–S5) have something honest to refuse. Placement (S2), the certified temperature map (S3), and cooling refusals (S5) build on this vocabulary without reshaping it.

Structs§

CoolingBoundary
DigitalTierPower
The digital tier’s sourced power injection.
Material
A tier’s bulk material for lateral heat spreading.
StackTarget
The composed stack — tiers bottom-up, gap i between tier i and tier i+1.
Tier
One tier of the stack, bottom-up.
VerticalClass
A counted vertical interconnect class in one gap — SCARCE like mul_tiles. TSVs conduct heat: g_w_per_k is per-via thermal conductance, a placement-dependent cooling lever.

Enums§

CoolingClass
How the stack sheds heat at its faces. S1 states the boundary; S5 makes the refusals.
FigureStatus
Provenance of a physical figure — the dossier discipline as a type.
StackShapeError
A shape violation — a stack that cannot mean anything is refused with a name.
TierFabric
What computes on a tier.
VerticalKind

Functions§

analog_artifact_on_stack
Compile an analog region ONTO a stack: resolve the analog tier and delegate to the 2D lane — the degenerate embed is bit-identical by construction (locked, not assumed).